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This single-layer flexible printed circuit (FPC) is specifically designed for Bluetooth headset applications. Built on Shengyi’s SF201 adhesiveless polyimide with a thickness of 0.15mm, it offers exceptional flexibility and durability. Manufactured to IPC 6012 Class 2 standards using provided Gerber data, this FPC ensures high-quality performance and reliability. Additionally, a polyimide stiffener is applied to the insertion area for enhanced structural integrity. Ideal for compact, high-performance wearable devices, this FPC delivers precision and reliability for cutting-edge Bluetooth technology. |
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Test Item |
Test Method |
Unit |
IPC
Standard |
Typical Value |
SF201 1012ST |
Peel Strength 90° |
IPC-TM-650,No.2.4.9
Method A
Method C |
N/mm |
≥0.525
≥0.525 |
1.27
1.32 |
Thermal Stress |
IPC-TM-650,No.2.4.13 |
- |
Pass |
Pass |
Dimensional Stability |
IPC-TM-650,No.2.2.4
Method B |
% |
±0.15 |
MD: -0.0208
TD: -0.0278 |
Chemical Resistance |
IPC-TM-650,No.2.3.2 |
% |
≥80 |
>90 |
Moisture Absorption |
IPC-TM-650,No.2.6.2 |
% |
≤2 |
1.4 |
Volume Resistivity |
IPC-TM-650,No.2.5.17 |
MΩ-cm |
≥10^6 |
2.18×10^9 |
Surface Resistance |
IPC-TM-650,No.2.5.17 |
MΩ |
≥10^5 |
1.07×10^7 |
Dielectric Constant 10GHz |
IEC-61189-2-721 |
- |
≤3.7 |
3.51 |
Dissipation Factor 10GHz |
IEC-61189-2-721 |
- |
≤0.01 |
0.0059 |
Folding Endurance (MIT method) |
JIS C 6471
R0.8×4.9N |
Times |
- |
>5000 |
Dielectric Strength |
IPC-TM-650,No.2.5.6.1 |
V/μm |
≥100 |
120 |
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Flexible Printed Circuit Boards (FPCs), commonly known as "soft boards" in the industry, are printed circuit boards crafted from flexible insulating substrates, predominantly polyimide or polyester films. They possess numerous advantages not found in rigid printed circuit boards. For instance, FPCs can be freely bent, coiled, and folded. By using FPCs, the volume of electronic products can be significantly reduced, making them suitable for the development of electronic products towards high density, miniaturization, and high reliability. As a result, FPCs have been extensively applied in various fields and products such as aerospace, military, mobile communication, laptops, computer peripherals, PDAs, digital cameras, and more.
FPCs also offer benefits like excellent heat dissipation, good solderability, ease of mounting, and low cost.
Flexible printed circuit boards come in single - layer, double - layer, and multi - layer configurations. The base material is polyimide clad laminate. This material features high heat resistance and good dimensional stability. After being pressed with a coating film that provides both mechanical protection and excellent electrical insulation, it becomes the final product. In double - sided and multi - layer printed circuit boards, the surface and inner conductors are metallized to achieve the electrical connection between the inner and outer layers.
The functions of flexible circuit boards can be categorized into four types: lead lines, printed circuits, connectors, and multifunction integrated systems. These functions are utilized in a wide range of areas, covering computers, computer peripheral auxiliary systems, consumer household appliances, and automobiles. |
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